Audio Engineering Society International Conference on Headphone Technology

The Audio Engineering Society, or AES, has just announced that it will be holding its second annual international conference from August 27–29, 2019 in San Francisco.

For those not in the know, the AES likes to keep its hands dirty with cutting-edge technology in both the theoretical and practical realms and as such this conference will be focusing on “technologies for headphones with a special emphasis on the emerging fields of Mobile Spatial Audio, Individualization, Assistive Listening and Audio for Augmented Reality. It will gather scientists, developers and practitioners who are involved in theory, technical design, application or evaluation of headphone technology” according to the Society.

This sounds like Comic-Con for headphone hardcores and should be an eye-opening experience for what’s happening in the headphone industry and more importantly – what’s going to be happening in the next year.

They are also putting out a call for a submission of papers (from four to 10 pages) as the conference will feature awards for Best Paper, Best Poster and Best Demonstration. So those involved in the industry who would like to see their new designs, ideas, R&D, patents or hardware get a light shone on them will be able to garner attention for their blood, sweat and tears. Only catch is the deadline is March 24, 2019. Papers must be submitted using the conference EasyChair submission system. Templates describing paper format will be available through the site and all submitted papers will be double-peer-reviewed before selection.

Further highlights from the AES press release:

Acceptance of papers will be determined by the conference review committee, and authors will be informed of the decision by May 20, 2019. Final versions of papers following any revisions guided by the committee’s review must be submitted by July 15, 2019. Based on several factors including scheduling, the conference committee may decide upon which contributions will be presented as talks, or posters, respectively. Posters will be held during exclusive time slots and feature short introductory talks of poster presenters.

Workshops, demonstrations, product presentations: Additionally, the committee invites all interested persons to propose demonstrations, workshops or thematically suited product presentations. Email proposals may be sent to by May 31, 2019. Demo acceptance notifications will be emailed by June 30, 2019.

Registration: At least one author of each contribution must attend to present, or it will not be included in the proceedings. Any author wishing to attend the conference must pay the registration fee. Sponsorship: A three-stage sponsorship system (Silver, Gold, and Platinum) has been proposed for this conference, partly including free exhibition space, and complementary registrations to the conference program. Please consult the conference website, under Sponsorship, for more information.

Proposed Topics

  • Design and Engineering: Acoustics, Transducers, Simulation, Ergonomics, Nonlinearities, Personalisation, Sensors and health data acquisition.
  • Applications: Binaural reproduction and spatial audio, Virtual and augmented reality, Assistive listening, hearing and health support, Connectivity, Noise control and hearing protection.
  • Evaluation: Headphone quality and standards, Automatic quality evaluation, Perceptual audio evaluation, Perceptual target.

  • Deadline for full-paper submissions: March-24-2019
  • Accepted authors notified by: May-20-2019
  • Deadline for demonstration proposals: May-31-2019
  • Accepted demonstrations notified by: June-30-2019
  • Deadline for final manuscripts and early registration: July-15-2019


Audio Engineering Society
551 Fifth Ave. Suite 1225, NY, NY 10176
+1 212 661 8528